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0PR100
Manufacturer: Ersa
(8 reviews)
Description:
The Dip & Print station enables the user to carry out component preparation (application of solder paste or flux) easily, reliably, and reproducibly. Optional dip stencils allow components to be dipped into flux or solder paste in a defined manner, thus creating a defined deposit at the solder connections. This process is suitable for BGA and most fine-pitch components. With a component-specific print stencil, e.g. QFN / MLF connections and those of other SMD components are easily and precisely provided with a solder paste deposit.
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